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Thursday, August 6, 2020 | History

3 edition of International Electron Devices Meeting found in the catalog.

International Electron Devices Meeting

San Francisco, Ca., December 8-11, 1996 : technical digest.

by International Electron Devices Meeting (1996 San Francisco, Calif.)

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  • 1 Currently reading

Published by IEEE in Piscataway, NJ .
Written in English


Edition Notes

ContributionsInstitute of Electrical and Electronic Engineers. Electron Devices Society.
ID Numbers
Open LibraryOL22177288M
ISBN 100780333942

  T3 - Technical Digest - International Electron Devices Meeting, IEDM. SP - BT - IEEE International Electron Devices Meeting, IEDM PB - Institute of Electrical and Electronics Engineers Inc. T2 - 63rd IEEE International Electron Devices Meeting, IEDM Y2 - 2 December through 6 December ER -Cited by: IEEE International Electron Devices Meeting (IEDM) IEEE International Electron Devices Meeting (IEDM) IEEE International Electron Devices Meeting (IEDM) IEEE International Electron Devices Meeting (IEDM) IEEE International Electron Devices Meeting (IEDM).

IEEE International Electron Devices Meeting Technical Digest, pp. ‐, • Devices with L g down to 17 nm were successfully fabricated L g = 30 nm W fin = 20 nm H fin = 50 nm L g = 30 nm W fin = 20 nm H fin = 50 nm Plan View   T3 - Technical Digest - International Electron Devices Meeting, IEDM. SP - BT - IEEE International Electron Devices Meeting, IEDM PB - Institute of Electrical and Electronics Engineers Inc. ER -Author: N. Kaji, M. Sano, S. Ito, H. Yasaki, T. Yasui, H. Yukawa, Y. Baba.

Advanced flexible CMOS integrated circuits on plastic enabled by controlled spalling technology. In IEEE International Electron Devices Meeting, IEDM (pp. ). [] (Technical Digest - International Electron Devices Meeting, IEDM).Cited by: International Electron Devices Meeting, IEDM DOIs: /IEDM; State: Published - Dec 1 Event: IEEE International Electron Devices Meeting, IEDM - Washington, DC, United States Duration: Dec 5 → Dec 7 Author: Benjamin R. Cipriany, Harold G. Craighead.


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Title IEEE International Electron Devices Meeting (IEDM ) Desc:Proceedings of a meeting held DecemberWashington, DC, USA. Prod#:CFP11IED-POD ISBN Pages (1 Vol) Format:Softcover Notes: Authorized distributor of all IEEE proceedings TOC:View Table of Contents Publ:Institute of Electrical and Electronics Engineers (IEEE) POD Publ:Curran.

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